Product
Home >
Products and Markets
>Thermosetting Resin Type
AeroWave 300
Characteristic
● Stabel Dk/Df over frequency and temperature
● Tight Dk tolerance control +/-0.05
● Excellent copper peel strength● UL 94 V-0 flame rating
● Thermal setting resin system with good PCB processibility and available for hybrid or multilayer design
Application Area
● Cellular base station antennas● Antenna feed networks
● Telemetry
● DAS & CPE antenna
● Massive MIMO antenna
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
|
Dielectric Constant, Process Dk |
IPC-TM-650 2.5.5.5 Clamped Stripline |
10GHz/23℃ | - | 3.0±0.05 (Z) |
|
Dielectric Constant, Design Dk |
Differential Phase Length Method |
1.5GHz-6GHz/23℃ | - | 2.98 (Z) |
| Dissipation Factor, Df |
IPC-TM-60 2.5.5. Clamped Stripline |
10GHz/23℃ | - | 0.0031 (Z) |
| Thermal Coefficient of Dk | IEC 61189-2-721 (10GHz) | -40~+120℃) | - | 50 (Z) |
| Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 200 |
| Td | ASTM D3850 | TGA | ℃ | 400 |
| Coefficient of Thermal Expansion | IPC-TM-650 2.4.41 | TMA | ppm/℃ | 15 (X) |
| IPC-TM-650 2.4.41 | TMA | ppm/℃ | 15 (Y) | |
| IPC-TM-650 2.4.41 | TMA | ppm/℃ | 50 (Z) | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ-cm | 2.21*108 |
| Surface Resistivity | IPC-TM-6502.5.17.1 | A | MΩ | 6.84*107 |
| Peel Strength | IPC-TM-650 2.4.8 | after solder float 1oz. HVLP foil | N/mm | 0.85 |
| Electrical Strength | IPC-TM-650 2.5.6.2 | 0.508mm (0.020'') | kV/mm | 60 (Z) |
| Flexural Strength | IPC-TM-650 2.4.4 | A | Mpa | 232/216 (LW/CW) |
| Water Absorption | IPC-TM-650 2.6.2.1 | - | % | 0.15 |
| Thermal Conductivity | ASTM D5470 | 100℃ | W/m·K | 0.46 |
| Flammability | UL94 | - | Rating | V-0 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.