SH260
特點
● Polyimide system
● Ultra-high thermal performance
● Tough resin system, Non-MDA chemistry
● Maintain mechanical strength and bonding strength at high temperature
● Halogen-free, chemistry and lead-free compatible
● RoHS/WEEE compliant
應用領域
Burn-in Board
Down Hole
Aircraft andAerospace
Other PCBrequirements to work under high temperature for long time
- 產品性能
- 產品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24 | TMA | ℃ | ＞250 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 429 |
| T300 |
2.4.24.1 |
TMA |
min |
＞60 |
| CTE (Z-axis) | 2.4.24 | 50-260℃ (X/Y) | ppm/℃ | 12-15 |
| α1 (before Tg) | ppm/℃ | 45 | ||
| 50-260℃ | % | 1.20 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.12 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.007 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.45 x 107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 4.79 x 107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 40.5 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm[lb/in] | 1.37[7.83] |
| Flexural Strength | 2.4.4 | 50℃/260℃ | MPa |
530/439 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
HB |
Remarks:
Specification sheet IPC-4101/40, /41, is for your reference only.
1. All the typical value is based on the 1.6mmspecimen, but 1) specimen thickness 0.1mm.
2. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd. for detailed information,
and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.