產(chǎn)品與市場
SF325C
特點
● 優(yōu)異的耐離子遷移性，不長枝狀結(jié)晶。
● 不含鹵素，阻燃性達到UL94 VTM-0級。
● 粘接強度高，尺寸穩(wěn)定性、耐熱性好。
● 溢膠量低，加工性好，適于快速壓合和傳統(tǒng)壓合。
● 滿足RoHS指令要求，不含鉛、汞、鎘、六價鉻、多溴聯(lián)苯、多溴聯(lián)苯醚等。
應(yīng)用領(lǐng)域
撓性印制電路板用覆蓋膜- 產(chǎn)品性能
- 產(chǎn)品證書
- 資料下載
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Peel Strength (90°)* | IPC-TM-650 2.4.9D | Accepted | N/mm | 1.2 |
| 288℃, 5s | 1.1 | |||
| Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
| Dimensional Stability |
SY Method |
After peeling off the paper |
% | -0.0083/-0.0021 |
| Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % |
＞90 |
| Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 100 |
| Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm |
8×107 |
| Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 |
MΩ |
8.5×106 |
| Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 3.18 |
| Dissipation Factor (10GHz) | SPDR |
C-24/23/50 |
- | 0.0125 |
| Resin Flow | IPC-TM-650 2.3.17.1 |
180℃/10+60s,100kg/cm2 |
mm | ＜0.15 |
| Flammability | UL94 | E-24/125 | Rating |
V-0 |
Remarks:
*Testing after laminating with shining side of copper foil in suitablecondition
1.Certified to IPC-4203/2 Epoxy adhesive on one or twosides of poyimide dielectric
2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.